CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas /
Corporate Authors: | American Society of Mechanical Engineers Electrical and Electronic Packaging Division, International Mechanical Engineering Congress and Exposition |
---|---|
Other Authors: | Agonafer, D. |
Format: | Book |
Language: | English |
Published: |
New York :
American Society of Mechanical Engineers ,
c1997 .
|
Subjects: |
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