CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas /

Corporate Authors: American Society of Mechanical Engineers Electrical and Electronic Packaging Division, International Mechanical Engineering Congress and Exposition
Other Authors: Agonafer, D.
Format: Book
Language:English
Published: New York : American Society of Mechanical Engineers , c1997 .
Subjects:
ΒιβλιοθήκηΤαξιθετικός αριθμόςΑριθμός ΑντιτύπωνΠληροφορίεςΚατάσταση
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