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20171111231341.0 |
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| 020 |
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|a 0791818527
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| 050 |
1 |
4 |
|a TK7870.25
|b .C34 1997
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| 082 |
0 |
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|2 21
|a 621.381/046
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| 245 |
0 |
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|a CAE/CAD and thermal management issues in electronic systems :
|b presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas /
|c sponsored by the Electrical and Electronic Packaging Division, ASME ;edited by Dereje Agonafer ... [et al.].
|
| 260 |
|
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|a New York :
|b American Society of Mechanical Engineers ,
|c c1997 .
|
| 300 |
|
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|a v, 109 p. :
|b ill. ;
|c 28 cm.
|
| 504 |
|
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|a Includes bibliographical references and index.
|
| 650 |
1 |
0 |
|a Computer-aided engineering
|x Congresses
|
| 650 |
1 |
0 |
|a Electronic apparatus and appliances
|x Temperature control
|x Congresses
|
| 650 |
1 |
0 |
|a Electronic packaging
|x Design
|x Data processing
|x Congresses
|
| 650 |
1 |
0 |
|a Heat sinks (Electronics)
|x Congresses
|
| 650 |
1 |
0 |
|a Heat
|x Transmission
|x Data processing
|
| 700 |
1 |
|
|a Agonafer, D.
|x Congresses
|
| 710 |
0 |
|
|a American Society of Mechanical Engineers
|b Electrical and Electronic Packaging Division
|
| 711 |
0 |
2 |
|a International Mechanical Engineering Congress and Exposition
|c Dallas, Tex.)
|d (1997 :
|
| 952 |
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|a GR-AtTEI
|b 59cc82a26c5ad13446fde9bf
|c 998a
|d 945l
|e -
|t 1
|x m
|z Books
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