Description: CAE/CAD and thermal management issues in electronic systems :

Corporate Authors:	American Society of Mechanical Engineers Electrical and Electronic Packaging Division, International Mechanical Engineering Congress and Exposition
Other Authors:	Agonafer, D.
Format:	Book
Language:	English
Published:	New York : American Society of Mechanical Engineers , c1997 .
Subjects:	Computer-aided engineering > Congresses Electronic apparatus and appliances > Temperature control > Congresses Electronic packaging > Design > Data processing > Congresses Heat sinks (Electronics) > Congresses Heat > Transmission > Data processing

Physical Description:	v, 109 p. : ill. ; 28 cm.
Bibliography:	Includes bibliographical references and index.
ISBN:	0791818527