Design flow, modeling and characterization of Through Silicon Via (TSV) for 3D integrated circuits/
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| Corporate Authors: | , |
| Other Authors: | , |
| Format: | Book |
| Language: | English |
| Published: |
Lausanne ; Volos:
[s.n.],
2013
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| Subjects: |
| Physical Description: | 95 p. : fig., tabl. ; 30 cm. |
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| Bibliography: | Περιέχει βιβλιογραφικές αναφορές (σ. 70-71). |