Fatigue life prediction of solder joints in electronic packages with ANSYS /

Main Author:	Madenci, Erdogan (Author)
Other Authors:	Guven, Ibrahim, Kilic, Bahattin
Format:	Book
Language:	English
Published:	Boston, Mass : Kluwer Academic Publishers , 2003 .
Subjects:	ANSYS (Computer system) Electronic packaging > Computer-aided design Metals > Fatigue Service life (Engineering) > Forecasting Solder and soldering > Quality control

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