|
|
|
|
| LEADER |
00960nam a2200241 a 4500 |
| 001 |
834769 |
| 005 |
20171111231242.0 |
| 008 |
021007s gr gr 00010 eng d |
| 020 |
|
|
|a 1402073305
|
| 082 |
0 |
|
|a 621.381/046
|
| 100 |
1 |
|
|4 aut
|a Madenci, Erdogan
|
| 245 |
1 |
0 |
|a Fatigue life prediction of solder joints in electronic packages with ANSYS /
|c Erdogan Madenci, Ibrahim Guven, Bahattin Kilic
|
| 260 |
|
|
|a Boston, Mass :
|b Kluwer Academic Publishers ,
|c 2003 .
|
| 300 |
|
|
|a xx, 185 p. :
|b ill. ;
|c 25 cm. +
|e 1 CD-ROM (4 3/4 in.)
|
| 504 |
|
|
|a Includes bibliographical references and index.
|
| 650 |
1 |
0 |
|a ANSYS (Computer system)
|
| 650 |
1 |
0 |
|a Electronic packaging
|x Computer-aided design
|
| 650 |
1 |
0 |
|a Metals
|x Fatigue
|
| 650 |
1 |
0 |
|a Service life (Engineering)
|x Forecasting
|
| 650 |
1 |
0 |
|a Solder and soldering
|x Quality control
|
| 700 |
1 |
|
|a Guven, Ibrahim
|
| 700 |
1 |
|
|a Kilic, Bahattin
|
| 952 |
|
|
|a GR-AtTEI
|b 59cc78bf6c5ad13446fc1059
|c 998a
|d 945l
|e 621.381 046 MAD
|t 1
|x m
|z Books
|
