Holdings: Introduction to surface mount assembly

Main Author:	Kimmel, Joel
Corporate Author:	Institute for Interconnecting and Packaging Electronic Circuits
Format:	Visual Material
Language:	English
Published:	Northbrook, IL. : IPC Science and Technology Press, 1997.
Subjects:	Surface mount technology. Electronic packaging. Solder and soldering.

Βιβλιοθήκη	Ταξιθετικός αριθμός	Αριθμός Αντιτύπων	Πληροφορίες	Κατάσταση
ΤΕΙ Κρήτης	TK7870.15 .K56 1994	4	Προβολή	OPAC