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Basic multilayer fabrication
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Basic multilayer fabrication
Corporate Author:
Institute for Interconnecting and Packaging Electronic Circuits
Format:
Visual Material
Language:
English
Published:
Northbrook, IL. :
IPC Science and Technology Press,
1997.
Subjects:
Printed circuits
Surface mount technology.
Τυπωμένα κυκλώματα.
Holdings
Description
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Staff View
Βιβλιοθήκη
Ταξιθετικός αριθμός
Αριθμός Αντιτύπων
Πληροφορίες
Κατάσταση
ΤΕΙ Κρήτης
TK7868 .P7B3 1992
2
Προβολή
OPAC
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