Basic multilayer fabrication

Corporate Author: Institute for Interconnecting and Packaging Electronic Circuits
Format: Visual Material
Language:English
Published: Northbrook, IL. : IPC Science and Technology Press, 1997.
Subjects:
LEADER 00886nam a2200193 a 4500
001 975784
005 20171111231441.0
008 030131s1997 ilu aaeng
040 |a GR-ChTEIE 
050 0 |a TK7868  |b .P7B3 1992 
245 1 0 |a Basic multilayer fabrication  |c Institute for Interconnecting and Pachaging Electronic Circuits. 
260 |a Northbrook, IL. :  |b IPC Science and Technology Press,  |c 1997. 
300 |a 1 videocassette (VHS) (35 min.) :  |b sd., col. ;  |c 1/2 in. 
500 |a This video reviews the common Fabrication process to produce a typical six.layer, multi-layer circuit board. 
650 0 |a Printed circuits 
650 0 |a Surface mount technology. 
650 4 |a Τυπωμένα κυκλώματα. 
710 2 |a Institute for Interconnecting and Packaging Electronic Circuits 
952 |a GRHeTEI  |b 59ccc6f66c5ad13446085cae  |c 998a  |d 945l  |e TK7868 .P7B3 1992  |t 2  |x vm  |z Visual Material