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|a 0792376765
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|a 621.381 046
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|a Foldable flex and thinned silicon multichip packaging technology /
|c edited by John W. Balde
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| 260 |
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|a Boston :
|b Kluwer Academic Publishers ,
|c c2003 .
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| 300 |
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|a xix, 338p. :
|b ill ;
|c 25 cm.
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| 504 |
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|a Includes bibliographical references and index.
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| 650 |
1 |
0 |
|a Ολοκληρωμένη μικροηλεκτρονική
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| 650 |
1 |
0 |
|a Microelectronic packaging
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| 650 |
1 |
0 |
|a Μικροηλεκτρονική
|
| 650 |
1 |
0 |
|a Microelectronics
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| 650 |
1 |
0 |
|a Ελαστικά τυπωμένα κυκλώματα
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| 700 |
1 |
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|a Balde, John W.
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| 952 |
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|a GR-AtTEI
|b 59cc78d86c5ad13446fc1571
|c 998a
|d 945l
|e 621.381 046 FOL
|t 1
|x m
|z Books
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