Description: Foldable flex and thinned silicon multichip packaging technology /

Other Authors:	Balde, John W.
Format:	Book
Language:	English
Published:	Boston : Kluwer Academic Publishers , c2003 .
Subjects:	Ολοκληρωμένη μικροηλεκτρονική Microelectronic packaging Μικροηλεκτρονική Microelectronics Ελαστικά τυπωμένα κυκλώματα

Physical Description:	xix, 338p. : ill ; 25 cm.
Bibliography:	Includes bibliographical references and index.
ISBN:	0792376765