Reliability of electronic packages and semiconductor devices/
| Main Author: | |
|---|---|
| Corporate Author: | |
| Format: | Book |
| Language: | English |
| Published: |
New York:
McGraw-Hill,
c1997
|
| Series: | Electronic packaging and interconnection series
|
| Subjects: |
| Physical Description: | xiv, 410 σ. : εικ. ; 24 εκ. |
|---|---|
| Bibliography: | Περιέχει βιβλιογραφικές παραπομπές και ευρετήριο |
| ISBN: | 007017024X |