Reliability of electronic packages and semiconductor devices/
| Main Author: | |
|---|---|
| Corporate Author: | |
| Format: | Book |
| Language: | English |
| Published: |
New York:
McGraw-Hill,
c1997
|
| Series: | Electronic packaging and interconnection series
|
| Subjects: |
| Βιβλιοθήκη | Ταξιθετικός αριθμός | Αριθμός Αντιτύπων | Πληροφορίες | Κατάσταση |
|---|---|---|---|---|
| Δημοκρίτειο Πανεπιστήμιο Θράκης | TK 7871 .85 | 1 | Προβολή | OPAC |