Advances in electronic circuit packaging : proceedings of the Second International Electronic Circuit Packaging Symposium, held at Boulder, Colorado /
| Corporate Authors: | , |
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| Other Authors: | |
| Format: | Book |
| Published: |
New York:
Plenum Press,
c1962
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| Subjects: |
| Item Description: | Sponsored by the University of Colorado and EDN (Electrical design news). |
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| Physical Description: | xiv, 328 p. : ill. ; 26 cm. |