Advances in electronic circuit packaging : proceedings of the Third International Electronic Circuit Packaging Symposium held at Boulder, Colorado, August 15-17, 1962 /
| Corporate Authors: | , |
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| Other Authors: | |
| Format: | Book |
| Published: |
New York:
Plenum Press,
1963
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| Subjects: |
| Item Description: | Sponsored by the University of Colorado, EDN (Electrical Design News), and Design News. |
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| Physical Description: | vi, 457 p. : ill. ; 26 cm. |
| Bibliography: | Includes bibliographical references. |