Advances in electronic circuit packaging : proceedings of the Fourth International Electronic Circuit Packaging Symposium held at Boulder, Colorado, August 14-16, 1963 /
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| Format: | Book |
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New York:
Plenum Press,
c1964
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| Item Description: | Sponsored by the University of Colorado, EDN (Electrical Design News), and Design News. |
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| Physical Description: | vi, 490 p. : ill. ; 26 cm. |
| Bibliography: | Includes bibliographical references. |