Cover Image

Reflow soldering processes : SMT, BGA, CSP and flip chip technologies /

Main Author:	Lee, Ning-Cheng.
Format:	Book
Language:	English
Published:	Boston : Newnes, ©2002.
Subjects:	Electronic apparatus and appliances > Design and construction. Solder and soldering. Electronic packaging. Electric connectors. TECHNOLOGY & ENGINEERING > Electronics > Microelectronics. TECHNOLOGY & ENGINEERING > Electronics > Digital.
Online Access:	http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=195116

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