Materials in microelectronic and optoelectronic packaging/

Corporate Authors: International Symposium on Materials for Optoelectronic and Microelectronic Packaging, American Ceramic Society, International Ceramic Science and Technology Congress
Other Authors: Ling, Hung C., Niwa, Koichi, Shukla, Vishwa N.
Format: Book
Language:English
Published: Westerville, Ohio: American Ceramic Society, c1993
Series:Ceramic transactions 33
Subjects:
ΒιβλιοθήκηΤαξιθετικός αριθμόςΑριθμός ΑντιτύπωνΠληροφορίεςΚατάσταση
Πανεπιστήμιο ΘεσσαλίαςPROC 621.381 046 INT1ΠροβολήOPAC