Packaging, reliability and manufacturing issues associated with electronic and photonic products /
| Corporate Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Book |
| Language: | English |
| Published: |
New York, N.Y. :
ASME,
c2001.
|
| Series: | EPP ;
v. 1 |
| Subjects: |
| Βιβλιοθήκη | Ταξιθετικός αριθμός | Αριθμός Αντιτύπων | Πληροφορίες | Κατάσταση |
|---|---|---|---|---|
| ΤΕΙ Αθήνας | 621.381 046 PAC | 1 | Προβολή | OPAC |