Thermoviscoplastic model with application to copper/

Main Author: Freed, Alan David
Corporate Authors: United States National Aeronautics and Space Administration Scientific and Technical Information Division, United States. National Aeronautics and Space Administration. Scientific and Technical Information Division, Lewis Research Center
Format: Book
Language:English
Published: Washington: National Aeronautics and Space Administration, Scientific and Technical Information Division, 1988
Series:NASA technical paper 2845
Subjects:
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245 1 0 |a Thermoviscoplastic model with application to copper/  |c Alan D. Freed 
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