Thermoviscoplastic model with application to copper/
| Main Author: | |
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| Corporate Authors: | , , |
| Format: | Book |
| Language: | English |
| Published: |
Washington:
National Aeronautics and Space Administration, Scientific and Technical Information Division,
1988
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| Series: | NASA technical paper
2845 |
| Subjects: |
| Physical Description: | 15 σ. : εικ. ; 28 εκ. |
|---|---|
| Bibliography: | Βιβλιογραφία: σ. 145-15 |