IEEE Transactions on Components, Packaging and Manufacturing Technology

Format: Book
Published: New York: Institute of Electrical and Electronics Engineers, Inc., 1978
Subjects:
Online Access:http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=95
http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=6144

Internet

http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=95
http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=6144
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