Silicon wafer bonding technology : for VLSI and MEMS applications /
Corporate Authors: | , , |
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Other Authors: | , |
Format: | Book |
Language: | English |
Published: |
London:
Institution of Electrical Engineers,
c2002
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Series: | EMIS processing series
no. 1 |
Subjects: |
Physical Description: | xxv, 149 σ. : εικ. ; 26 εκ. |
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Bibliography: | Περιέχει βιβλιογραφικές παραπομπές και ευρετήριο |
ISBN: | 0852960395 |