Silicon wafer bonding technology : for VLSI and MEMS applications /

Corporate Authors: Institution of Electrical Engineers, INSPEC Information service, EMIS Group
Other Authors: Iyer, Subramanian S., Auberton-Herve, Andre J.
Format: Book
Language:English
Published: London: Institution of Electrical Engineers, c2002
Series:EMIS processing series no. 1
Subjects:
Physical Description:xxv, 149 σ. : εικ. ; 26 εκ.
Bibliography:Περιέχει βιβλιογραφικές παραπομπές και ευρετήριο
ISBN:0852960395