Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
| Corporate Authors: | , |
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| Format: | Book |
| Language: | English |
| Published: |
Washington, D.C. : Alexandria, VA :
National Academy Press ; Available from Defense Technical Information Center, Cameron Station,
1990.
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| Online Access: | http://site.ebrary.com/lib/ucy/Doc?id=10060398 |
Internet
http://site.ebrary.com/lib/ucy/Doc?id=10060398| Βιβλιοθήκη | Ταξιθετικός αριθμός | Αριθμός Αντιτύπων | Πληροφορίες | Κατάσταση |
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